Physical and Chemical Specification: Volume Density ≥ 1.9g/cm3, Bidirectional Conductivity: 530W/m.K, Compressive Strength: 18MPa,

Flexural Strength: 12MPa

Application Area: High-end electronic information industry, high power LED industry, thermal management system for new energy vehicle power battery, high power supply, printed circuit board, CPU for large-scale computer and heat dissipation unit for civil industry, shielding electromagnetic wave and absorption of radiation.